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  ?2012 fairchild semiconductor corporation 1 www.fairchildsemi.com FGA15S125P rev. c3 FGA15S125P ? 1250 v, 15 a shorted-anode igbt august 2013 absolute maximum ratings thermal characteristics notes: 1: limited by tjmax symbol description ratings unit v ces collector to emitter voltage 1250 v v ges gate to emitter voltage 25 v i c collector current @ t c = 25 o c30 a collector current @ t c = 100 o c15 a i cm (1) pulsed collector current 45 a i f diode continuous forward current @ t c = 25 o c30 a diode continuous forward current @ t c = 100 o c15 a p d maximum power dissipation @ t c = 25 o c136 w maximum power dissipation @ t c = 100 o c68 w t j operating junction temperature -55 to +175 o c t stg storage temperature range -55 to +175 o c t l maximum lead temp. for soldering purposes, 1/8? from case for 5 seconds 300 o c symbol parameter typ. max. unit r jc (igbt) thermal resistance, junction to case, max - 1.1 o c / w r ja thermal resistance, junction to ambient, max - 40 o c / w FGA15S125P 1250 v, 15 a shorted-anode igbt features ? high speed switching ? low saturation voltage: v ce(sat) = 2.25 v @ i c = 15 a ? high input impedance ? rohs compliant applications ? induction heating, microwave oven general description using advanced field stop trench and shorted-anode technol- ogy, fairchild?s shorted-anode trench igbts offer superior con- duction and switching performances for switching applications. the device can operate in parall el configuration with excep- tional avalanche capability . this device is designed for induc- tion heating and microwave oven. ge c to-3pn g e c
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 2 www.fairchildsemi.com FGA15S125P rev. c3 package marking and ordering information electrical characteristi cs of the igbt t c = 25c unless otherwise noted device marking device package re el size tape width quantity FGA15S125P FGA15S125P to-3pn - - 30 symbol parameter test conditions min. typ. max. unit off characteristics i ces collector cut-off current v ce = 1250v, v ge = 0v - - 1 ma i ges g-e leakage current v ge = v ges , v ce = 0v - - 500 na on characteristics v ge(th) g-e threshold voltage i c = 15ma, v ce = v ge 4.5 6.0 7.5 v v ce(sat) collector to emitter saturation voltage i c = 15a , v ge = 15v t c = 25 o c -2.252.72 v i c = 15a , v ge = 15v t c = 125 o c -2.5- v i c = 15a , v ge = 15v, t c = 175 o c -2.75- v v fm diode forward voltage i f = 15a , t c = 25 o c-22.55v i f = 15a , t c = 175 o c -2.55- v dynamic characteristics c ies input capacitance v ce = 30v , v ge = 0v, f = 1mhz - 1360 - pf c oes output capacitance - 40 - pf c res reverse transfer capacitance - 20 - pf switching characteristics t d(on) turn-on delay time v cc = 600v, i c = 15a, r g = 10 , v ge = 15v, resistive load, t c = 25 o c -10- ns t r rise time - 260 - ns t d(off) turn-off delay time - 400 - ns t f fall time - 100 - ns e on turn-on switching loss - 0.74 - mj e off turn-off switching loss - 0.50 - mj e ts total switching loss - 1.24 - mj t d(on) turn-on delay time v cc = 600v, i c = 15a, r g = 10 , v ge = 15v, resistive load,, t c = 175 o c -11-ns t r rise time - 320 - ns t d(off) turn-off delay time - 420 - ns t f fall time - 250 - ns e on turn-on switching loss - 0.94 - mj e off turn-off switching loss - 1.23 - mj e ts total switching loss - 2.17 - mj q g total gate charge v ce = 600v, i c = 15a, v ge = 15v - 129 - nc q ge gate to emitter charge - 9 - nc q gc gate to collector charge - 66 - nc
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 3 www.fairchildsemi.com FGA15S125P rev. c3 typical performance characteristics figure 1. typical output characteristics figure 2. typical output characteristics figure 3. typical saturation voltage figure 4. transfer characteristics characteristics figure 5. saturation voltage vs. case figure 6. saturation voltage vs. v ge temperature at variant current level 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0 10 20 30 40 50 60 70 80 v ge =17v 20v 15v 12v 9v 10v 8v t c = 25 o c collector current, i c [a] collector-emitter voltage, v ce [v] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0 10 20 30 40 50 60 70 80 v ge =20v 17v 15v 12v 9v 10v 8v t c = 175 o c collector current, i c [a] collector-emitter voltage, v ce [v] 01234567891011121314 0 10 20 30 40 50 common emitter v ce = 20v t c = 25 o c t c = 175 o c collector current, i c [a] gate-emitter voltage, v ge [v] 0.0 1.0 2.0 3.0 4.0 5.0 0 10 20 30 40 50 60 common emitter v g e = 15v t c = 25 o c t c = 175 o c --- collector current, i c [a] collector-emitter voltage, v ce [v] 0 4 8 12 16 20 0 5 10 15 20 30a 15a i c = 7.5a common emitter t c = 25 o c collector emitter voltage, v ce [v] gate-emitter voltage, v ge [v] 25 50 75 100 125 150 175 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 30a i c = 7.5a 15a common emitter v ge = 15v collector-emitter voltage, v ce [v] case temperature, t c [ o c]
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 4 www.fairchildsemi.com FGA15S125P rev. c3 typical performance characteristics figure 7. saturation voltage vs. v ge figure 8. capacitance characteristics figure 9. gate charge characteristics figure 10. soa characteristics figure 11. turn-on characteristics vs. figure 12. turn-off characteristics vs. gate resistance gate resistance 4 8 12 16 20 0 4 8 12 16 20 30a 15a i c = 7.5a common emitter t c = 175 o c collector emitter voltage, v ce [v] gate-emitter voltage, v ge [v] 5 1015202530 1 1000 10000 100 10 common emitter v g e = 0v, f = 1mhz t c = 25 o c c ie s c oe s c re s capacitance [pf] collector-emitter voltage, v ce [v] 0 10203040506070 0 3 6 9 12 15 600v 400v v cc = 200v common emitter t c = 25 o c gate emitter voltage, v ge [v] gate charge, q g [nc] 1 10 100 1000 0.01 0.1 1 10 100 1ms 10ms dc *notes: 1. t c = 25 o c 2. t j = 175 o c 3. single pulse 10 s 100 s collector current, i c [a] collector-emitter voltage, v ce [v] 10 20 30 40 50 60 70 t r t d(on) 5 200 common emitter v c c = 600v, v ge = 15v i c = 15a t c = 25 o c t c = 175 o c --- switching time [ns] gate resistance, r g [ ] 10 20 30 40 50 60 70 1000 100 t f t d(off) 10000 common emitter v c c = 600v, v ge = 15v i c = 15a t c = 25 o c t c = 175 o c --- switching time [ns] gate resistance, r g [ ]
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 5 www.fairchildsemi.com FGA15S125P rev. c3 typical performance characteristics figure 13. turn-on characteristics vs. figure 14. turn-off characteristics vs. collector current collector current figure 15. switching loss vs. gate resistance figure 16. switching loss vs. collector current figure 17. turn off switching figure 18. forward characteristics soa characteristics 15 30 500 1000 7.5 t f t d(off) 100 common emitter v ge = 15v, r g = 10 t c = 25 o c t c = 175 o c --- switching time [ns] collector current, i c [a] 15 30 10 1000 7.5 t r t d(on) 100 common emitter v ge = 15v, r g = 10 t c = 25 o c t c = 175 o c --- switching time [ns] collector current, i c [a] 10 20 30 40 50 60 70 100 1k 10k e off e on common emitter v c c = 600v, v ge = 15v i c = 15a t c = 25 o c t c = 175 o c --- switching loss [uj] gate resistance, r g [ ] 15 30 100 1k 10k 0 7.5 e on e off common emitter v ge = 15v, r g = 10 t c = 25 o c t c = 175 o c --- switching loss [uj] collector current, i c [a] 12 0.1 1 10 forward voltage, v f [v] 80 0.5 t c = 25 o c --- t c = 175 o c forward current, i f [a] 1 10 100 1000 1 10 100 safe operating area v ge = 15v, t c = 175 o c collector current, i c [a] collector-emitter voltage, v ce [v]
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 6 www.fairchildsemi.com FGA15S125P rev. c3 typical performance characteristics f i g u r e 1 9 . t ra n s i e n t t h e r m a l i m p e d a n c e o f i g b t 1e-5 1e-4 1e-3 0.01 0.1 1 10 100 0.1 1 1.2 0.01 0.02 0.1 0.05 0.2 single pulse thermal response [zthjc] rectangular pulse duration [sec] duty factor, d = t1/t2 peak t j = pdm x zthjc + t c 0.5 t 1 p dm t 2
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 7 www.fairchildsemi.com FGA15S125P rev. c3 mechanical dimensions figure 20. to-3p 3l - 3ld, t03, plastic, eiaj sc-65 package drawings are provided as a service to customers considering fairchil d components. drawings may change in any manner without notice. please note the revision and/or date on the draw ing and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specif- ically the warranty therein, wh ich covers fairchild products. always visit fairchild semiconductor?s online pack aging area for the most recent package drawings: http://www.fairchildsemi.com/package/pa ckagedetails.html?id=pn_tt3p0-003 dimensions in millimeters
FGA15S125P ? 1250 v, 15 a shorted-anode igbt ?2012 fairchild semiconductor corporation 8 www.fairchildsemi.com FGA15S125P rev. c3 trademarks the following includes registered and unregistered trademarks and service marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *trademarks of system general corporation, used under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes withou t further notice to any products herein to improve reliability, function, or design. fairchild does not assume an y liability arising out of th e application or use of any product or circuit described herein; neither does it convey an y license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s worldwide terms and conditio ns, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized fo r use as critical components in life support devices or systems without the express written approval of fa irchild semiconductor corporation. as used here in: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform w hen properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms accupower? ax-cap ? * bitsic? build it now? coreplus? corepower? crossvolt ? ctl? current transfer logic? deuxpeed ? dual cool? ecospark ? efficentmax? esbc? fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore? fetbench? fps? f-pfs? frfet ? global power resource sm greenbridge? green fps? green fps? e-series? g max ? gto? intellimax? isoplanar? marking small speakers sound louder and better? megabuck? microcoupler? microfet? micropak? micropak2? millerdrive? motionmax? mwsaver ? optohit? optologic ? optoplanar ? powertrench ? powerxs? programmable active droop? qfet ? qs? quiet series? rapidconfigure? saving our world, 1mw/w/kw at a time? signalwise? smartmax? smart start? solutions for your success? spm ? stealth? superfet ? supersot?-3 supersot?-6 supersot?-8 supremos ? syncfet? sync-lock? ?* tinyboost ? tinybuck ? tinycalc? tinylogic ? tinyopto? tinypower? tinypwm? tinywire? transic? trifault detect? truecurrent ? * serdes? uhc ? ultra frfet? unifet? vcx? visualmax? voltageplus? xs? ? ? datasheet identification product status definition advance information formative / in design datasheet contains the design specifications for product development. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supplementary data will be published at a later date. fairchild semiconductor reserves the ri ght to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specifications. fair child semiconductor reserves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specifications on a product t hat is discontinued by fairchild semiconductor. the datasheet is for reference information only. anti-counterfeiting policy fairchild semiconductor corporation?s anti-counterfeiting policy. fairchild?s anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support . counterfeiting of semiconductor parts is a growing problem in th e industry. all manufactures of semiconductor products are expe riencing counterfeiting of their parts. customers who inadvertently purchase counterfeit parts ex perience many problems such as loss of brand reputation, substa ndard performance, failed application, and increased cost of production and manufacturing dela ys. fairchild is taking strong measures to protect ourselve s and our customers from the proliferation of counterfeit parts. fairchild strongly encourages customers to purchase fairchild parts either directly from fa irchild or from authorized fairchild distributors who are listed by country on our web page cited above . products customers buy either from fairchild directly or fr om authorized fairchild distributors are genuine parts, have full traceability, meet fairchild?s quality standards for handing and storage and provide access to fairchild?s full range of up-to-date technical and product information. fairchild and our authorized distributors will stand behind all warranties and wi ll appropriately address and warranty issues that may arise. fairchild will not provide any warranty coverage or other assistance for parts bought from unau thorized sources. fairchild is committed to combat this global problem and encourage our customer s to do their part in stopping th is practice by buying direct or from authorized distributors. rev. i66 ?


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